The source has released images that allegedly show retail packaging for 12th Gen Intel Core (Alder Lake) processors.
So far, it doesn’t look like any Core i9, i7, and i5 K and KF series processors expected to ship in November will ship with a cooling system. While the flagship model, the Core i9-12900K, will receive a unique packaging design, the rest of the new generation will be packaged in standard-sized boxes familiar to customers from the previous generation of Intel Core processors.
The Core i9-12900K package will contain a small “silicon wafer”. This, of course, is not a real plate, but only an unusual and attractive design element.
As you know, Intel plans to announce the release of Alder Lake-S desktop processors on October 28. On the same day, retailers will be allowed to take pre-orders for the new processors, and they will go on sale on November 4th.
There is no Core i3 packaging in the illustrations. This can be considered confirmation of rumors that Intel will release entry-level models at a later date.
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