Qualcomm has unveiled the next generation of the 3D Sonic Max ultrasonic fingerprint scanner ahead of CES 2022 in Las Vegas, which has many improvements over the previous generation.
Now 3D Sonic Max covers a larger area, supports dual fingerprint recognition at the same time, provides faster operation and is more secure. Thanks to this, smartphones will soon appear with more efficient under-screen fingerprint scanners and faster responses.
This sensor uses advanced ultrasonic technology to read 3D lines on the user’s fingers. The sensor will generate more accurate fingerprint images even if the finger is wet.

Qualcomm guarantees that the new technology featured in 3D Sonic Max can penetrate the surface of objects such as glass and metal for accurate fingerprint scanning. In addition, the company’s ultrasonic sensors currently cover only a small portion of the screen, but the new model covers 17 times the area, and the scanner can handle the job in just 0.2 seconds. Now you don’t need to touch a specific point at the bottom of the screen. The smartphone should still quickly recognize the fingerprint.
Another novelty that Qualcomm has unveiled is that the new sensor also supports simultaneous reading of two fingerprints. This will enhance the security of mobile payments and other applications.

For example, parents will be able to set up certain apps to unlock with two fingerprints (their own and their child’s), so kids can only unlock the phone with the help of their parents. On the other hand, the new 3D Sonic Max adopts a more compact and ultra-thin design (only 0.2mm), so it can be used in thinner smartphones.
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