TSMC is mastering the 3-nanometer process technology in accordance with the previously outlined schedule. This was announced during a press conference on the results of the quarter, its CEO Xi Xi Wei (CC Wei). He specified that the risky production of products at 3 nm standards will begin this year, and in the second half of next year, the manufacturer expects to launch mass production.
“The development of N3 technology is in full swing according to plan,” the source of the words of the head of TSMC cites. “And we see much higher customer interest in the N3 for supercomputers and smartphones compared to the N5 and N7 at a similar stage.”
Preliminary information has been confirmed that TSMC’s capital investments in 2021 will exceed $ 20 billion. Moreover, the amount indicated during the press conference turned out to be much larger – the company plans to allocate $ 25-28 billion.
When asked if the increase in capex was related to orders from Intel, Wei said the company would not comment on specific customers and orders.
“The intensity of TSMC’s capital investment remains high due to the complexity of the technology,” explained the CEO of the increase. According to him, the main reason for the increase in capital investment is the cost of equipment for EUV lithography.
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