TSMC is working on several 3nm process technologies. At least the N3, N3B and N3E variants are currently in development. Production using the N3 process is scheduled for 2023, and the N3E node was originally planned for 2024, but now it looks like it will be ready ahead of schedule. According to the source, N3E was supposed to be an improved version of N3, but now it seems to be more of an alternative with fewer layers formed using EUV lithography. Presumably the number of layers will be reduced from 25 to 21, which will simplify production. The price to pay for this is a lower packing density. According to Morgan Stanley, N3E is about 8% inferior to N3 in this indicator, but still about 60% superior to N5. The original N3 version is 70% more dense than N5.
The development of the N3E process technology is said to be completed by the end of this month, which means that the development timeline is approaching for the whole quarter, from the third to the second quarter of 2023.
There is no information about the N3B process technology yet. It is believed that this is a variation of N3, optimized for the requirements of some customers.
Source: ixbt
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