This week Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company announced the formation of a new industry consortium and introduced Universal Chiplet Interconnect Express (UCIe) technology, which, as stated in joint press release, “will serve as the backbone of the chipset ecosystem and future generations of chipset technologies.”
The members of the consortium approved the UCIe 1.0 specification, which defines a complete, standardized interconnect with physical layer, protocol stack, software model, and conformance testing so that single-chip designers can easily mix chipsets from different vendors.
The UCIe 1.0 specification uses the industry-recognized PCI Express (PCIe) and Compute Express Link (CXL) standards. The specification will be made available to UCIe members.
The consortium is open to new members.
Source: ixbt
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