Intel CEO unveils IDM 2.0 strategy

Intel hosted Intel Unleashed: Engineering the Future, an online event where CEO Pat Gelsinger presented its semiconductor strategy. In short, the company intends not only to maintain its own production, but also to significantly expand it, hoping to become a large contract manufacturer.

Integrated device manufacturing (IDM) 2.0 includes an investment of approximately $ 20 billion to build two new factories in Arizona adjacent to Intel’s existing facility.

Intel CEO unveils IDM 2.0 strategy

IDM 2.0 is built on three pillars that the company expects “will provide sustainable leadership in technology and manufacturing.

First, it is Intel’s global internal manufacturing network for large-scale manufacturing, which has been cited as a key competitive advantage. Gelsinger attributed the development of a 7-nanometer technology based on the use of EUV lithography to the success of his own production. The first product – a die for a client processor known as Meteor Lake – should be ready in the next quarter. Intel’s advances in packaging technology will allow these crystals to be combined with others to provide products tailored to specific customer requirements.

Second, by expanding its work as a contract manufacturer, Intel expects to strengthen existing relationships with customers who already rely on Intel technology.

Third, an autonomous business unit called Intel Foundry Services (IFS) is being created, led by semiconductor industry veteran Dr. Randhir Thakur, who will report directly to Gelsinger. The company intends to become a major provider of contract manufacturing services in the United States and Europe.

Intel CEO promised to announce the next stage of expansion of capacities in the USA, Europe and other regions of the world within a year.

Intel plans to attract industry partners to implement the IDM 2.0 program. In particular, it announced plans to collaborate with IBM in research to create next generation technologies.

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