Intel’s ambitious plans. The company wants to bypass TSMC and Samsung, and also move faster than Moore’s Law

Intel in the foreseeable future is waiting for the big changes, which it talked about earlier. Among other things, these changes should lead to the fact that Intel will be able to compete with the market leaders in the modernity of the process technology.

The head of the company Pat Gelsinger (Pat Gelsinger) in another interview raised the topic of Moore’s Law. Recall, according to this law, the number of transistors in integrated circuits doubles every two years. At some point in time, the law was criticized for the fact that it is no longer relevant, but in general the market complies with it.

Moore’s Law is alive and well. Today we predict that over the next decade we will stick to it, or even faster. As Moore’s Law agents, we will relentlessly strive to innovate

Gelsinger pointed to two new developments that should help Intel catch up or even beat TSMC and Samsung. The first is RibbonFET. This is a new transistor structure known as Gate All Around FET (GAAFET). This design uses four gates to control the current flowing through the transistors.

The second development is called PowerVia. It deals with internal connections. The technology allows transistors to consume electricity from one side of the chip, while using the other side to connect to data links. Today’s IC designs contain transistors that attempt to do both functions from the same side, which reduces the ability for developers to simplify the process and also limits miniaturization.

Taking into account all the developments, according to the head of Intel, the company will be able to catch up with TSMC and Samsung in 2024 and bypass them in 2025.