Taiwanese chipmaker MediaTek is preparing to release several new mobile processors. There is also a new member of the MediaTek Dimensity series among them, which in terms of performance can be compared with last year’s flagship Qualcomm chip. We are talking about the Dimensity 8100, the technical characteristics of which were revealed by the authoritative Chinese insider Digital Chat Station.
According to the source, the new MediaTek Dimensity 8100 chip will be manufactured using TSMC’s 5nm process. It will include four high-performance Cortex-A78 cores clocked at up to 2.85GHz, four power-efficient Cortex-A55 cores clocked at 2GHz, and the G610 MC6 graphics accelerator. Based on GFX Bench ES 3.0 Manhattan results (around 170fps), MediaTek’s graphics performance is on par with the Adreno 660 accelerator found in last year’s Qualcomm Snapdragon 888 and 888+.
It is also reported that the MediaTek Dimensity 8100 will be compatible with LPDDR5 RAM and UFS 3.1 built-in storage.
As expected, the premiere of MediaTek Dimensity 8100 will take place in the near future, but the exact date is still unknown. Rumor has it that the chip will debut in the new Redmi smartphone, which will hit the market in March 2022. True, there is no information about him yet.
Source: Trash Box
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