On the first day of spring, March 1, Taiwanese chipmaker MediaTek introduced three new chips for mobile devices to the market. These are the high-end Dimensity 8000 and 8100 chipsets, built using a 5nm process technology, as well as the Dimensity 1300 platform, which is a slight update to the previously released Dimensity 1200 chip.
Dimensity 8000 and 8100
The two chips essentially share the same hardware, but the Dimensity 8100 looks like the more interesting option due to its higher CPU clock speeds and faster graphics. Both chipsets support all modern types of wireless connections, including 5G and Wi-Fi 6E (2×2), and are suitable for installation in smartphones with high-resolution displays and refresh rates.
Specifications Dimensity 8000 and 8100:
- Technological process: 5 nm.
- CPU: Dual-cluster octa-core, 4x Cortex-A78 @ 2.75GHz for Dimensity 8000/2.85GHz for Dimensity 8100, 4x Cortex-A55 at 2GHz.
- GPU: Mali-G610 MC6 (Dimensity 8100 is 20% faster than 8000).
- RAM: LPDDR5.
- Built-in storage: UFS 3.1.
- Display: Full HD+ at 168Hz and WQHD+ at 120Hz (Dimensity 8100).
- Cameras: up to 200 MP.
- Video Capture: 4K at 60fps with HDR10+.
- Wireless communications: 5G (up to 4.7 Gb / s), Wi-Fi 6E, Bluetooth 5.3.
Dimension 1300
As for the Dimensity 1300, it is almost identical to the original Dimensity 1200. The only obvious difference is the improved performance of the NPU unit, which provides better performance in night mode shooting and video processing using artificial intelligence.
Specifications Dimensity 1300:
- Technological process: 6 nm.
- CPU: Tri-cluster eight-core, 1 Cortex-A78 core @ 3GHz, 3 Cortex-A78 cores @ 2.6GHz, 4 Cortex-A55 cores @ 2GHz.
- Graphics accelerator: Mali-G77 MC6.
- RAM: LPDDR4x.
- Built-in storage: UFS 3.1.
- Display: Full HD+ with 168Hz refresh rate.
- Cameras: up to 200 MP.
- Video shooting: 4K at 60 frames per second.
- Wireless communications: 5G (up to 4.7 Gb / s), Wi-Fi 6, Bluetooth 5.2.
Source: Trash Box
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