Samsung Electronics has introduced a technology for packing semiconductor crystals into packages, which is called I-Cube4. This is a new generation technology designed to increase the competitiveness of the South Korean manufacturer in the contract manufacturing market, where its main competitor TSMC is increasing its share by using its own packaging technology.
I-Cube4 is a heterogeneous integration technology in which one or more logic dies (CPU, GPU, etc.) and several HBM memory dies are placed in a horizontal plane on top of a silicon transition die, so that several dies can be considered as one.
Back in March, the company created a product in which four HBM dies and one logic die were combined using Samsung I-Cube4 technology. The I-Cube4 is expected to provide a new level of energy efficiency and fast communication between logic and memory. According to the manufacturer, such a layout can find application in solutions for high performance computing (HPC), artificial intelligence applications, 5G, cloud computing and large data centers.
Since, with the described arrangement, the silicon junction die area increases in proportion to the number of logic crystals and HBM, the risk of deformation increases. Samsung’s knowledge and experience in the semiconductor industry has tackled this problem. Note that the thickness of the transition crystal is about 100 μm.
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