Talk about a new RAM has been going on for a long time, and today, on March 25, Samsung Electronics officially announced a DDR5 memory bar, which is already ready to hit the market with its characteristics. To begin with, the volume of one memory module can reach 512 GB – for this, the manufacturer uses twenty 8-layer memory chips, 16 GB on each side, on the printed circuit board. Actually, the company has been using a similar method since 2014 for the production of server modules of DDR4 RAM, but in the case of the current generation of memory, the maximum volume is 256 GB.
In addition, the new memory has insane performance – Samsung employees in a press release announced a data transfer rate of 7200 Mbps, which is double that of DDR4. In addition, thanks to the High-K Metal Gate technology, which is also used in the production of GDDR6, DDR5 strips are 13% more energy efficient. All this will allow the memory of the new generation to satisfy the demands of the modern market, but, of course, we are not talking about the consumer segment, but about the corporate one. This memory was created for use in computing centers, data centers, cloud services, platforms for managing smart homes, supercomputers and industry.

It is for this reason that the manufacturer does not disclose all the technical features of the new memory, and, of course, no one reports the price of the modules either. On the other hand, ordinary users should not worry – Intel engineers are already working with Samsung to implement DDR5 support in Intel Xeon processors of the Saphire Rapids generation, and AMD will implement similar support in EPYC processors. And if you believe the information of analysts, DDR5 will enter the consumer market at the end of 2021 or already at the beginning of 2022, while full-fledged dominance of the new generation memory can be expected by 2025.

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