SK Hynix is at the forefront of the next generation of high bandwidth multilayer memory, HBM3. Like modern HBM2e memory, HBM3 memory will be used in multi-chip processor modules for supercomputers. Although the full specifications for HBM3 have not yet been released, the manufacturer has revealed some key details of the new standard.
It is said to be available at 5.2Gbps per pin, 44% more than the 3.6Gbps for HBM2e. As a result, the bandwidth per stack will increase from 480 GB / s in the case of HBM2e to 665 GB / s. Thus, a processor connected by a 4096-bit bus with four such stacks will have a memory bandwidth of 2.66 TB / s.
The source suggests that SK Hynix uses DBI Ultra 2.5D / 3D hybrid technology licensed from Xperi in the HBM3 stacks.