Earlier, MediaTek officially announced that the new Dimensity SoCs will be officially unveiled on January 20.
Now, sources have announced that the new flagship platform, which will replace the Dimensity 1000+, will be called the Dimensity 1200. It will be manufactured using a 6nm manufacturing process, which will increase performance and energy efficiency over the Dimensity 1000+.
It is also reported that the Dimensity 1200 will outperform last year’s flagship Snapdragon 865 SoC, which was clocked at 2.84 Hz. However, processor performance won’t be the only improvement in the Dimensity 1200.
The source notes that the Dimensity 1200 will receive an improved modem for working on fifth-generation networks, as well as an improved image processing processor (ISP), which will allow phones to take better photos.
The Dimensity 1200 is expected to appear in phones from Vivo, Oppo, Realme and iQOO, as well as Honor and Huawei.
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