TSMC has partnered with National Taiwan University (NTU) and Massachusetts Institute of Technology (MIT) to make significant breakthroughs in the development of 1nm chip technology.
The researchers found that using the semi-metal bismuth (Bi) as contact electrodes for two-dimensional elements can significantly reduce resistance and increase current. This discovery was made by a team at the Massachusetts Institute of Technology and then further refined by TSMC and NUT. It is expected to improve the energy efficiency and performance of future processors.
The technical process based on the 1 nm norms can be developed within several years, but for now TSMC plans to start production at the 3 nm norms in the second half of 2022.
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