ASUS has announced the presentation of the ROG Phone 6D Ultimate gaming smartphone, the key feature of which will be an unusual solution for cooling the device by the company’s engineers. Often, it is an efficient cooling system that is the main factor when creating a mobile device for gaming, so some manufacturers offer not only powerful passive cooling, but also active cooling in the form of overlays with a fan. Asus has taken a different approach to this issue, with the ROG Phone 6D Ultimate designed with a flip cover that exposes the copper heatsink and thus better cools the internal components.
If you look closely at the images from the database of the Chinese regulator TENAA, you will notice that the special cover is small and is located in the middle of the smartphone. This solution allows users to open it themselves to improve heat dissipation from the chipset.
According to previously leaked information, ASUS ROG Phone 6D Ultimate will be equipped with a Dimensity 9000+ chipset, a Samsung 165Hz AMOLED display, a 50MP Sony IMX766 sensor, and a 6000mAh battery with support for 65W fast charging. The upcoming novelty has already appeared in the AnTuTu benchmark, where it scored 1.14 million points. This result surpasses the current flagship smartphones based on the Snapdragon 8+ Gen 1 platform. In the graphics test, its performance was 430 thousand points.
The official presentation of ASUS ROG Phone 6D Ultimate will take place on September 19th.
Source: Trash Box
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