Samsung, one of the leading suppliers of RAM, intends to lead the development of the new DDR5 standard. Recently, a South Korean manufacturer posted a video on YouTube showing Samsung’s technology used in DDR5-7200 modules, and now the company has officially unveiled the world’s first 512GB DDR5-7200 memory module.
The new modules use advanced layering technology. The same can be observed in the latest DDR4 memory modules, but the difference is that DDR4 has a four-layer stack of crystals combined using 3D TSV (Through Silicon Via) technology, while DDR5 has an eight-layer stack. Thanks to a new way of layering, Samsung has managed to reduce the distance between them and make the crystals 40% thinner. The height of the finished microcircuit is only 1 mm compared to 1.2 mm for DDR4, and the declared read speed reaches 6400 Mbps, which is twice as fast as the previous generation.



The increase in performance did not affect energy efficiency. The technology used in DDR5 memory helps consume 30% less power thanks to a lower voltage – 1.1 V instead of 1.2 V. Another feature is Same Bank Refresh technology, which allows you to separate the operations performed by memory cells. In addition, memory bus performance has been increased by 10%.
Samsung plans to supply DDR5 RAM for data centers, as well as for smartphones and laptops. True, consumer DDR5 modules are likely to have up to 64 GB per module. Production of 512 GB sticks will begin at the end of this year.
Source: Trash Box

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